Global Thermal Interface Materials Market Is Expected to Witness an Incredible Growth by 2027 with COVID -19 Impact
Thermal Interface Material is a material that moves heat between two surfaces. The best TIMs are made of materials that have high thermal conductivity and low thickness, involve the most un-conceivable volume, don't hang over the long haul or under pressure, bond unequivocally to both mating parts, are not difficult to work inside assembling conditions without presenting air rises during gathering activities.
ChemIntel360’s global Thermal Interface Materials Market study is a 200+ slide report containing in-depth analysis on historical and forecasted spending and consumption patterns in the sector. We offer granular value and volume data from a global, regional, application, and type perspective. The industry is expected to grow at a CAGR of 10.4% mainly due to growing demand for miniaturized electronic devices which is expected to bolster the market over the forecast period.
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Scope
This study contains global and regional market size data. The numbers are broken down by application (Computers, Telecom, Medical devices, Industrial Machinery, Consumer Durables, Automotive Electronics and Others), by type (Greases and Adhesives, Tapes and Films, Automotive, Medical, Building and Construction, Others). The historical period runs through 2015-2020 and the forecasted period from 2021-2026.
The significant driver for the development of the thermal connection point materials market is the arising need of exceptionally quick registering administrations. The expansion in the mindfulness for the productive lighting frameworks has expanded with the increment being used of LED lights over the regular lights, which is thusly driving the warm connection point materials market. The critical elements of warm point of interaction materials, for example, high warm conductivity, no spillage from point of interaction and least thickness are making it reasonable for use across different end-client ventures like PC, auto and modern hardware among others.
Market Overview
The global Thermal Interface Materials market, which grew from US$X.X billion in 2015 to US$X.X billion in 2019, dropped marginally to US$2.8 billion in 2020, due to the ongoing COVID-19 pandemic. Spending is expected to recover in 2021 to value US$X.X billion and increase to US$X.X billion in 2026 at a CAGR of X.X%. Cumulatively the market is expected to value US$X.X billion during the forecast period as compared to US$X.X billion during the historical period.
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Key Players:
The key players of Thermal interface materials market are 3M Company (U.S.), Henkel Corporation (U.S.), Bergquist Company (U.S.), Indium Corporation (U.S.), Parker Chomerics (U.S.), Dow Corning (U.S.), Laird Technologies (U.S.), Momentive Performance Materials Inc. (U.S.), and Zalman Tech Co., Ltd. (South Korea) among others.
About Us:
ChemIntel360, part of AgileIntel’s broader research offering, provides an integrated portfolio of quantitative and qualitative research reports on the chemicals sector. Our studies make use of credible market intelligence.
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