This report contains market size and forecasts of Chip Encapsulation Material in Global, including the following market information:
- Global Chip Encapsulation Material Market Revenue, 2017-2022, 2023-2028, ($ millions)
- Global top five companies in 2021 (%)
The global Chip Encapsulation Material market was valued at 24470 million in 2021 and is projected to reach US$ 33810 million by 2028, at a CAGR of 4.7% during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Substrates Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Chip Encapsulation Material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, Mitsui High-tec, Inc., Chang Wah Technology, Panasonic, Henkel and Sumitomo Bakelite, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Chip Encapsulation Material companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Chip Encapsulation Material Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Chip Encapsulation Material Market Segment Percentages, by Type, 2021 (%)
- Substrates
- Lead Frame
- Bonding Wires
- Encapsulating Resin
- Others
Global Chip Encapsulation Material Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Chip Encapsulation Material Market Segment Percentages, by Application, 2021 (%)
- Consumer Electronics
- Automotive Electronics
- IT and Communication Industry
- Others
Global Chip Encapsulation Material Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Chip Encapsulation Material Market Segment Percentages, By Region and Country, 2021 (%)
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Nordic Countries
- Benelux
- Rest of Europe
- Asia
- China
- Japan
- South Korea
- Southeast Asia
- India
- Rest of Asia
- South America
- Brazil
- Argentina
- Rest of South America
- Middle East & Africa
- Turkey
- Israel
- Saudi Arabia
- UAE
- Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies Chip Encapsulation Material revenues in global market, 2017-2022 (estimated), ($ millions)
- Key companies Chip Encapsulation Material revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
- Shennan Circuit Company Limited
- Xingsen Technology
- Kangqiang Electronics
- Kyocera
- Mitsui High-tec, Inc.
- Chang Wah Technology
- Panasonic
- Henkel
- Sumitomo Bakelite
- Heraeus
- Tanaka
Table of content
1 Introduction to Research & Analysis Reports
1.1 Chip Encapsulation Material Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Chip Encapsulation Material Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Chip Encapsulation Material Overall Market Size
2.1 Global Chip Encapsulation Material Market Size: 2021 VS 2028
2.2 Global Chip Encapsulation Material Market Size, Prospects & Forecasts: 2017-2028
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Chip Encapsulation Material Players in Global Market
3.2 Top Global Chip Encapsulation Material Companies Ranked by Revenue
3.3 Global Chip Encapsulation Material Revenue by Companies
3.4 Top 3 and Top 5 Chip Encapsulation Material Companies in Global Market, by Revenue in 2021
3.5 Global Companies Chip Encapsulation Material Product Type
3.6 Tier 1, Tier 2 and Tier 3 Chip Encapsulation Material Players in Global Market
3.6.1 List of Global Tier 1 Chip Encapsulation Material Companies
3.6.2 List of Global Tier 2 and Tier 3 Chip Encapsulation Mater
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