North America Thin-Film Encapsulation Market is expected to gain market growth in the forecast period of 2021 to 2028
North America Thin-Film Encapsulation Market, By Deposition Technologies (Inorganic Layers, Organic Layers), Flexible OLED Design (Cathode, Anode), Application (Flexible OLED Display, Flexible OLED Lighting, Thin-Film Photovoltaics, Others), Country (U.S., Mexico, Canada) Industry Trends and Forecast to 2028
Market Analysis and Insights: North America Specialty Gas Market
· Data Bridge Market Research analyses the North America thin-film encapsulation market will exhibit a CAGR of 19.20% for the forecast period of 2021-2028 and is expected to reach the USD 74.18 million by 2028.
· Thin film encapsulation is referred to the technology that provides flexible protection of devices against moisture, water and other contaminating elements. It can be deposited through an organic and inorganic layer. Thin film encapsulation has the main applicability in smart devices, including smart wearables, smartphones, and smart watches evolving to flexible device structures
North America Thin-Film Encapsulation Market Scope and Market Size
· Based on deposition technologies, the thin-film encapsulation market is segmented into inorganic layers and organic layers. Inorganic layers have been further sub-segmented into plasma-enhanced chemical vapor deposition (PECVD) and atomic layer deposition (ALD). Organic layers have been further sub-segmented into inkjet printing and vacuum thermal printing.
· The thin-film encapsulation market on the basis of flexible OLED design is segmented into cathode and anode.
· Based on application, the thin-film encapsulation market is segmented into flexible OLED display, flexible OLED lighting, thin-film photovoltaics and others. Flexible OLED display has been further sub-segmented into smartphones, smart wearables, television and large format display.
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North America Thin-Film Encapsulation Market Country Level Analysis
· The countries covered in the North America thin-film encapsulation market report are U.S., Canada and Mexico.
Competitive Landscape and North America Thin-Film Encapsulation Market Share Analysis
· North America thin-film encapsulation market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to North America thin-film encapsulation market.
The major players covered in North America thin-film encapsulation market report are
· AMS Group
· Glaston Corporation
· Meyer Burger Technology AG
· Beneq, Rolic Technologies AG
· Veeco Instruments Inc
· MBRAUN
· SAES Getters S.p.A
· Picosun Oy
· Angstrom Engineering Inc
· KANEKA CORPORATION
· Kyoritsu Chemical & Co.,Ltd
· SNU PRECISION CO., LTD
· SAMSUNG SDI CO.,LTD
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MAJOR TOC OF THE REPORT
· INTRODUCTION
· MARKET SEGMENTATION
· EXECUTIVE SUMMARY
· PREMIUM INSIGHTS
· MARKET OVERVIEW
· QUESTIONNAIRE
RELATED REPORTS
Get TOC Details
https://www.databridgemarketresearch.com/toc/?dbmr=north-america-thin-film-encapsulation-market
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