Physical vapor deposition refers to a variety of deposition methods that can be used to produce thin coatings and films. Physical vapor deposition is a process in which the surfaces of various products, such as solar products, cutting tools, storage devices, microelectronics, medical equipment, etc., are coated with materials to form a thin protective film. In this process, the material transferred from condensed phase to vapor phase and then back to the condensation phase of thin films. Physical vapor deposition coatings are deposited for many reasons, such as to improve oxidation resistance, reduce friction, and improve hardness and wear resistance.
Physical vapor deposition is widely used in various applications, such as fabrication of optical and conductive coatings, diffusion barriers, interconnects, and fuel cell electrodes, surface modifications batteries, and microelectronic devices. Three commonly used physical vapor deposition in almost all industries are ion plating, sputtering, and thermal evaporation. It is extensively used in manufacturing of aluminized PET film for food packaging, titanium nitride coated cutting tools for metalworking, and semiconductor devices like thin-film solar panels.
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