Local Business UV Tapes are used in semiconductor and dicing processes to achieve a stronger adhesive bond after exposure to ultraviolet light vivekcmi 620 views Ultra-Violet (UV) tapes are a kind of pressure sensitive tape which have strong adhesion strength. These tapes hare used to hold wafer strongly during wafer dicing or wafer back-grinding process. « Previous interiors Construction advanced materials UV Tapes Wafer Dicing Back-grinding